Disc package for semiconductor wafers



FIG. 1 is a top front perspective view of a disc package forsemiconductor wafers;

FIG. 2 is a front elevational view thereof, the undisclosed rear portionis a mirror image of the front;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof; and,

FIG. 5 is a side elevation view thereof, the opposite side is a mirrorimage of the side shown.

The ornamental design for the disc package for semiconductor wafers, asshown and described.